Engineering Exhibitions in the Midwest this Month

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April 26, 2023

May is the season for Spring flowers in the Midwest, and it’s also the season for local technical conferences. Always well-attended, these events serve local engineers and local industries with expert-led sessions and industry exhibitions. 

The IEEE EMC Chicago MiniSymposium and the Southeastern Michigan EMC Fest have arranged to have Dr. Eric Bogatin and Dr. Todd Hubing appear at both events. Whether you’re in the Chicago area or the Detroit area, you’ll be able to attend their excellent presentations.

Elite has always played an important role in the success of these events and this year is no exception. If you’re located near Chicago or Detroit this month, take advantage of these convenient and economical chances to learn what’s new, expand your network, and when you find them, say hello to your friends from Elite.

The 23rd Annual IEEE International Conference on Electro Information Technology

May 18-20

Lewis University

Romeoville, Illinois

http://www.emcchicago.org/sectfiles/events.htm

The EIT Conference is focused on basic/applied research results in the fields of electrical and computer engineering as they relate to Electrical and Computer Engineering, Information Technology, and related applications. The Conference provides a forum for researchers and industrial engineers to exchange ideas and discuss developments in these growing fields. There will also be exhibits where the latest electro/information technology tools and products will be showcased, along with opportunities for professional activities development, workshops and tutorials.

IEEE EMC Society Chicago Chapter MiniSymposium

May 23, 2023 

Chandler’s

401 N. Roselle Road, Schaumburg, Illinois

http://www.emcchicago.org/sectfiles/events.htm

If you are working in EMC, our MiniSymposium is for you!

You will come away with new ideas about troubleshooting techniques, specification updates and a better understanding on how to measure critical parameters.

While there, browse tabletop booths of manufacturers, EMI/EMC test labs, and learn more about industry suppliers. Meet with fellow EMC Engineers and learn more about how our local IEEE EMC Chapter can assist you in your daily challenges.

Featured speakers:

Dr. Eric Bogatin is a Signal Integrity Evangelist with Teledyne LeCroy and the Dean of the Teledyne LeCroy Signal Integrity Academy, at Be The Signal. Additionally, he is an Adjunct Professor at the University of Colorado – Boulder in the ECEE dept, and technical editor of the Signal Integrity Journal.

Dr. Todd Hubing is a Professor Emeritus of Electrical and Computer Engineering at Clemson University and President of LearnEMC. Dr. Hubing holds a BSEE degree from MIT, an MSEE degree from Purdue University and a Ph.D. from North Carolina State University. He was an engineer at IBM for 7 years and a faculty member at the University of Missouri-Rolla (UMR) for 17 years before joining Clemson University in 2006. He was also a founding faculty member of the UMR Electromagnetic Compatibility Laboratory.

Contact: Frank Krozel, 2023 IEEE EMC MiniSymposium Chair — 630-924-1600  

frank@electronicinstrument.com

Southeastern Michigan IEEE EMC Society EMC Fest 

May 25, 2023

Embassy Suites by Hilton Detroit Livonia Novi

Livonia, Michigan

After completing their presentations at the Chicago MiniSymposium, EMC experts Eric Bogatin and Todd Hubing will speak at the Southeastern Michigan event. If you are in the area, don’t miss it!

Dr. Eric Bogatin is a Signal Integrity Evangelist with Teledyne LeCroy and the Dean of the Teledyne LeCroy Signal Integrity Academy, at Be The Signal. Additionally, he is an Adjunct Professor at the University of Colorado – Boulder in the ECEE dept, and technical editor of the Signal Integrity Journal.

Dr. Todd Hubing is a Professor Emeritus of Electrical and Computer Engineering at Clemson University and President of LearnEMC. Dr. Hubing holds a BSEE degree from MIT, an MSEE degree from Purdue University and a Ph.D. from North Carolina State University. He was an engineer at IBM for 7 years and a faculty member at the University of Missouri-Rolla for 17 years before joining Clemson University in 2006. At the University of Missouri-Rolla (now the Missouri University of Science and Technology), he was a founding faculty member of the UMR Electromagnetic Compatibility Laboratory.